Intel has unveiled more details about its upcoming Panther Lake chip, officially called Intel Core Ultra series 3. Built using the 18A process at its Arizona facility, it will feature a multi-chiplet SoC design, RibbonFET transistors, and Foveros packaging. The processor promises 50% faster performance, improved efficiency, and 180 TOPS AI capability.
ByteDance’s $2.5B AI Chip Deal Tests US Export Controls
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March 17, 2026
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